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[Patent] Method for Manufacturing And/Or Packaging A Chip


Document Type and Number: United States Patent Application 20170144150 Kind Code: A1

Abstract: In one aspect, disclosed herein are methods for packaging biochips, including microfluidic chips. The method can comprise bonding a substrate and a cover slide, packaging the bonded chip, creating a vacuum in the package, and applying a pressure on the packaged chip. The method is particularly useful for minimizing bubble formation during low-cost and mass production of microfluidic chips.

Inventors: Wang, Lei (Beijing, CN) Zhou, Xinying (Beijing, CN) MA, Li (Beijing, CN) Xin, Juan (Beijing, CN) Lin, Mingxian (Beijing, CN) Feng, Jinhai (Beijing, CN) Application Number: 15/356461 Publication Date: 05/25/2017 Filing Date: 11/18/2016

Link: http://www.freepatentsonline.com/y2017/0144150.html

#05312017 #labonachip

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