[Patent] Method for Manufacturing And/Or Packaging A Chip
Document Type and Number: United States Patent Application 20170144150 Kind Code: A1
Abstract: In one aspect, disclosed herein are methods for packaging biochips, including microfluidic chips. The method can comprise bonding a substrate and a cover slide, packaging the bonded chip, creating a vacuum in the package, and applying a pressure on the packaged chip. The method is particularly useful for minimizing bubble formation during low-cost and mass production of microfluidic chips.
Inventors: Wang, Lei (Beijing, CN) Zhou, Xinying (Beijing, CN) MA, Li (Beijing, CN) Xin, Juan (Beijing, CN) Lin, Mingxian (Beijing, CN) Feng, Jinhai (Beijing, CN) Application Number: 15/356461 Publication Date: 05/25/2017 Filing Date: 11/18/2016