[ACS Appl. Mater. Interfaces] Low Ceiling Temperature Polymer Microcapsules with Hydrophobic Payload
We report a microencapsulation procedure based on rapid solvent evaporation to prepare microcapsules with hydrophobic core materials and low ceiling temperature polymer shell wall of cyclic poly(phthalaldehyde) (cPPA). We use and compare microfluidic and bulk emulsions. In both methods, rapid solvent evaporation following emulsification resulted in kinetically trapped core-shell microcapsules while slow evaporation resulted in acorn morphology. Through the systematic variation of encapsulation parameters, we found that polymer-to-core weight ratios higher than 1 and polymer concentration higher than 4.5 wt% in the oil phase were required to obtain a core-shell structure. This microencapsulation procedure enabled the fabrication of microcapsules with high core loading, controlled size, morphology, and stability. This procedure is versatile, allowing for the encapsulation of other hydrophobic core materials, i.e., mineral oil and organotin catalyst, or using an alternative low ceiling temperature polymer shell wall, poly (vinyl tert-butyl carbonate sulfone).
Shijia Tang, Mostafa Yourdkhani, Catherine M. Possanza Casey, Nancy R Sottos, Scott R. White, and Jeffrey S. Moore
ACS Appl. Mater. Interfaces, Just Accepted Manuscript
Publication Date (Web): May 25, 2017
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