Abstract:

Migration of lab-on-chip configurations into the optical fiber platform opens the revolutionary prospect of lab-in-fiber systems on the basis of an efficient optical transport highway for multifunctional sensing. In this paper, three-dimensional microfluidic channels patterning inside the fiber by femtosecond laser ablation, femtosecond laser assisted splicing and selective chemical etching will be introduced in terms of machining mechanism and accuracy. In these approaches, we have successfully achieved phase-shifted FBG sensor based on in-grating bubble and several in-fiber cavity based interferometric sensors and also preliminarily explore their applications in biochemical analysis.

Changrui Liao

Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, 518060, China

Lei Xu

School of Electronic and Communication Engineering, Shenzhen Polytechnic, 518055, China

Zhengyong Li

Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, 518060, China

Feng Zhu

Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, 518060, China

Tianhang Yang

Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, 518060, China

Kuikui Guo

Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, 518060, China

Yiping Wang

Key Laboratory of Optoelectronic Devices and Systems of Ministry of Education and Guangdong Province, College of Optoelectronic Engineering, Shenzhen University, 518060, China

Published in: Optical Communications and Networks (ICOCN), 2016 15th International Conference on

Date of Conference: 24-27 Sept. 2016

Date Added to IEEE Xplore: 13 March 2017

DOI: 10.1109/ICOCN.2016.7875603

Link: http://ieeexplore.ieee.org/abstract/document/7875603/

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